Transducer head solder connection

Connection soudée de tête de transducteur

Lötverbindung für Wandlerkopf

Abstract

A method for the fabrication of a data recording disk file slider-suspension assembly, the slider being of the type having an air bearing surface, a back side opposite the air bearing surface and a trailing edge having a read or write transducer formed as a thin film thereon with electrical leads formed solely on the trailing edge and terminating adjacent the slider back side at termination pads, and a suspension having etched conductive lead structures and conductive contact pads connected to the lead structures. The method comprising the steps of forming a solder bump on each of the termination pads and each of the contact pads, wherein one or more solder bumps are selectively flattened, mechanically attaching the back side of the slider to the suspension such that the termination pads are properly aligned with the contact pads, and heating the solder bumps so as to reflow the termination pad and contact pad bumps such that they electrically connect, wherein a selectively flattened bump extends along an axis defined by a point on one pad and a point on another pad when heated to make contact with another bump.

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Patent Citations (2)

    Publication numberPublication dateAssigneeTitle
    JP-S56111234-ASeptember 02, 1981Hitachi LtdSemiconductor integrated circuit device and manufacture thereof
    US-4761699-AAugust 02, 1988International Business Machines CorporationSlider-suspension assembly and method for attaching a slider to a suspension in a data recording disk file

NO-Patent Citations (2)

    Title
    PATENT ABSTRACTS OF JAPAN vol. 13, no. 216 (E - 760) 19 May 1989 (1989-05-19)
    PATENT ABSTRACTS OF JAPAN vol. 5, no. 186 (E - 084) 25 November 1981 (1981-11-25)

Cited By (0)

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